Detailed Product Description

 Asia General Series no clean Lead Free Solder Paste were developed according to IPC and JIS standards,and completely coinciding with RoHS directives.Our pastes are composed of environment-friendly flux and low oxidation spherical powder,which were characterized by long continuous repeatability printing time,high print definition,excellent solderability,and bright and smooth solder joint.Special formulation designs deliver excellent rheology and high viscosity retention ability even after extended open time.The wide reflow process window of our products is designed to minimize transition concerns from tin-lead to lead free solder paste.With near transparent and no corrosion residue,our pastes gurantees high surface insulation resistance and offers high in-circuit pin test yields.

                                    P-YT20031         P-YT20032            P-YT20033             P-YT20051

Alloy Composition    Sn3.0Ag0.5CuRE    Sn0.3Ag0.7CuRE   Sn1.0Ag0.5CuRE    Sn58Bi

Powder Size      TypeIII 25~45um       TypeIII 25~-45um    Type III 25~45um  Type III25~45um

                        TypeIV 20-38um       TypeIV 20-38um      TypeIV 20-38um    TypeIV 20-38um

SIR(Ω)                ≥1x10^{12                     ≥1x1012                        ≥1x1012                      ≥1x1012}

Corrosion of Residue  No corrosion     No corrosion          No corrosion            No corrosion

We also have other types solder paste products with different alloy components from the above table.please contact us for the details